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Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Data Sheet Filter B69843N3507A160 Application RF filter for WLL (Wireless Local Loop) Features SMD filter consisting of coupled resonators with stepped impedances MgTiO3-CaTiO3 (r = 21 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 Component drawing Footprint Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Data Sheet Filter B69843N3507A160 Component drawing 1.6 0.2 0.1 0.05 I/O 0.8 0.2 G G I/O 0.7 0.3 3.5 0.3 G G 8.0 0.1 3.0 0.1 View from below onto the solder terminals and view from beside Footprint recommended 4.6 1.5 1.9 1.2 compatible footprint 6.6 4.0 1. I/O 2.0 G I/O 1.4 I/O G I/O 1.4 1.0 G G 1.4 G G G 1.4 G ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Data Sheet Characteristics min. Center frequency Insertion loss Passband Amplitude ripple (peak - peak) Standing wave ratio Impedance Power Attenuation at DC to 2800 MHz at 2800 to 3240 MHz at 3900 to 5000 MHz at 5000 to 7200 MHz fc IL B 160 SWR Z P typ. Filter B69843N3507A160 max. 1.8 MHz dB MHz 3500.0 1.2 0.5 1.5 50 1.0 2.0 dB 1.0 W dB dB dB dB 40 26 25 20 45 Maximum ratings IEC climatic category (IEC 68-1) Operating temperature - 40/+ 90/56 Top -40 / + 85 C Typical passband characteristic 3,000 3,050 3,100 3,150 3,200 3,250 3,300 3,350 3,400 3,450 3,500 3,550 3,600 3,650 3,700 3,750 3,800 3,850 3,900 3,950 4,000 S11 [dB] S21 [dB] 0 -5 -10 -15 Attenuation [dB] -20 -25 -30 -35 -40 -45 -50 Frequency [GHz] ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station Data Sheet Processing information Wettability acc to IEC 68-2-58: 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Recommended soldering conditions (infrared): Temp. [C] within 10 sec. Filter B69843N3507A160 Profile for leadfree solder paste reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Temp. [C] within 10 sec. 215C10C 245C5C 20-40 sec. 40-80 sec. Time [sec.] 30 sec. 2.5 C/s 2-3 min. Time [sec.] > - 5 C/s Delivery mode Blister tape acc. to IEC 286-3, PS, grey Pieces/tape: 2000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 08.04.04 ISSUE A PUBLISHER SAW MWC PD PAGE 4/4 |
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